II B.E. (Electronics & Communication)

VII SEMESTER

7 EC4 IC TECHNOLOGY

1. INTRODUCTION TO TECHNOLOGIES: Semiconductor Substrate-Crystal defects, Electronic Grade Silicon, Czochralski  Crystals; Wafer preparation- Silicon Shaping, Etching and polishing, Chemical cleaning,

2. DIFFUSION & ION IMPLANTION : Fick.diffusion Equation in One Dimension. Atomic model, Analytic Solution of Ficks law, correction to simple theory, Diffusion ill SiO₂. Ion implantation and Ion Implantation Systems Oxidation. Growth mechanism and Deal-Grove Model of oxidation, Linear and Parabolic Rate coefficient, the structure of SiO₂, Oxidation techniques and system Oxide properties.

3. CHEMICAL VAPOUR DEPOSITION AND LAYER GROWTH: CVD for deposition of dielectric and polysilicon -a simple CVD system, Chemical equilibrium and the law of mass action, Introduction to atmospheric CVD of dielectric, low pressure CVD of dielectric and semiconductor. Epitaxy-Vapour Phase Expitaxy, Defects in Epitaxial growth, Metal Organic Chemical Vapor Deposition, Molecular beam epitaxy.

4. PATTERN TRANSFER: Introduction to photo/optical lithography, Contact/ proximity printers, Projection printers, Mask generation, photoresists. Wet etching, Plasma etching, Reaction ion etching.

5. VLSI PROCESS INTEGRATION: Junction and Oxide Isolation, LOCOS methods, Trench Isolation, SOL; Metallization, Planarization. Fundamental consideration for IC Processing, NMOS IC Technology, CMOS IC Technology, Bipolar IC Technology.

 Recommended Books :

1. S.M. Sze -VLSI Technology, Tata Mc-Graw Hill.

2. D. Nagchoudhary -principles of Microelectronic Technology, Wheeler Publishing.

3. Stephen A Campbell -The Science and Engineering Microelectronic Fabrication. Oxford University Press.

4. Hong Xiao -introduction to Semiconductor Manufacturing, Prentice Hall India.

5. Kang -CMOS circuit design, Tata Mc-Graw Hill.

6. Razoni -Design of COMOS Analog Integrated circuit.